Omron will be exhibiting at the Sensors Expo in San Jose this June. If anyone is interested in registering, please follow the link or click the image below!
Today’s military must be equipped with the most advanced, effective combat systems available. From military grade tablets and smart phones to 3-D imaging headsets and hand-held radios, our rugged, high performance interconnect solutions transmit power, data & signal to a wide range of soldier-worn devices and equipment. No matter the environment, our highly engineered connectors withstand extreme temperature fluctuations, shock, vibration and high pressure to support soldiers in the field.
For more info please click image below or visit HERE
The Spectrum Sales team will be attending the 2018 EDS Summit at The Mirage in Las Vegas next week (May 15-18, 2018)! We’d like to wish all of our participating distribution partners and principals the very best of luck and safest of travels. We look forward to meeting with you both in and outside of meetings next week and hope to get time with each and every one of you!
For more information and a complete list of companies participating in the EDS Summit this year, please check out the links below:
- MOS FET Relay in module package with SPDT (1C)
- This model of operated by voltage (Rated input voltage is 5 VDC.)
- Contribute to reduce the mounting space on the print circuit board by small package
- Contact form 1c (SPDT)
- Load Voltage 60 V
- RoHS Compliant
FOR IMMEDIATE RELEASE: May 7, 2018 Contact: Neda Simeonova / Communications Director / firstname.lastname@example.org
The Electronics Representatives Association (ERA) has announced the appointment of the chair, vice chair and members of the committee tasked with the development of its 50th Anniversary Management and Marketing Conference program, scheduled Feb. 24-26, 2019, at the AT&T Conference Center in Austin, Texas.
The chair of the committee is John Hutson, CPMR, of MacInnis Group and the vice chair is Mike Swenson of Mel Foster Company. Both Hutson and Swenson are returning committee members.
Hutson said, “It is an honor and a privilege to be chosen as the 2019 ERA Conference Chairperson. Although the incredible success of recent conferences, and the fact that the 2019 ERA Conference will be the 50th Anniversary Conference has set the bar exceptionally high, I am confident that delivering another gold medal performance will be possible with the outstanding conference planning committee that we have in place.”
The 2019 ERA Conference Committee is strategically made up of representatives, manufacturers and distributors with the goal of creating a diverse pool of experience and insight that result in the highest level of quality content to be shared at the ERA Conference.
In addition to Hutson and Swenson, other returning members of the ERA 2019 Conference Committee are: Ken Bellero of Schaffner EMC; Holly Myers, CPMR, of Wallace Electronic Sales; and Bryan White of Catalyst Sales Inc.
New members of the committee are: Kingsland Coombs, CPMR, CSP, of Control Sales; Paul Dosser of DigiKey; Brian Flynn of Sager Electronics; Terri Straube of Straube Associates Inc.; and Tom Vanderheyden of TTI Inc.
Coombs and Dosser will serve as co-chairs of the Keynote Committee; Straube and Vanderheyden will serve as co-chairs of the General Session Committee; Flynn and Myers will serve as co-chairs of the Breakout Sessions Committee; and Bellero and White will serve as co-chairs of the Sponsorship Committee.
ERA staff members on the committee are: Walter Tobin, the association’s CEO; Erin Collins, the conference coordinator; and Neda Simeonova, the conference app coordinator.
“This year’s ERA Conference Committee is made up of industry leaders who exceed all the criteria necessary for the making of a successful conference, and I am excited to watch them collectively work their magic,” Hutson said. “The right conference planning committee is vital to a successful conference, but so too is the commitment of the attendees. I hope that the industry shows its support for our Golden 50th Jubilee, and our industry as a whole, by supporting the conference through record-breaking attendance and sponsorship.”
ERA CEO Walter E. Tobin added, “ERA is thrilled to be hosting its 50th Golden Jubilee Conference at the AT&T Executive Education and Conference Center in Austin, Texas. This will be the fourth year in a row that we have held our conference at this great venue in such a great city. Following on the success of our last conference, which drew a record number of attendees, the 2019 Conference Committee is tasked with the mission of developing another outstanding program. I am confident that the 2019 50th Anniversary Conference will be a success!”
Industrial & Power Control
Littelfuse offers many different innovative solutions for Industrial and Power Control applications, such as industrial machines, robotic equipment, motors, generators and transformers.
View datasheets and request samples for our latest SiC power products. (HERE)
Precise and extremely reliable temperature sensing probes and assemblies for demanding applications such as HVAC/R. (HERE)
Today’s commercial aerospace manufacturers & defense contractors are increasingly challenged to meet the ongoing demand for lighter, high reliability interconnect solutions that support a wide range of applications. Our new MKJ Clip Lock Miniature Circular Connector offers an ideal solution for today’s connectivity needs. Small, lightweight and competitively priced, the MKJ Clip Lock repurposes a clip lock latching system originally designed for the automotive industry.
MKJ Mini-Circular Video Featuring NEW MKJ Clip Lock:
NANO2® 885 Series Surface Mount Fuses: AEC-Q200 qualified protection against overcurrent events.
- High DC voltage up to 500V DC and interrupting current ratings up to 1500A
- Reliable/robust fuse design (solderless platform)
- Meets AEC-Q200 automotive qualifications
- Surface mountable with a compact footprint of 10.86 x 4.78mm
- Operating temperature range from -40°C to 85°C
- Provides robust protection for electrical vehicles against severe fault/short-circuit currents
- Minimizes the risk of nuisance opening due to mechanical bonding failure, which is mostly associated with traditional fuse soldering, providing better performance for consistent functionality
- Ensures reliability in harsh automotive environment
- Ideal for applications constrained by limited printed circuit board space and where legacy through-hole fuses cannot be used
- Can be used in extreme ambient conditions
For a product presentation, market/application notes and more please click HERE.
Davies Molding has been designing and manufacturing insert-molded knobs, handles, cases and custom plastic components since 1933. Learn more about our capabilities and see our manufacturing facility in action.
Please check out the video/link below!
For more information on Davies Molding’s capabilities and offering please click HERE.