Lattice Semiconductor – New SensAI Solutions

New sensAI Solutions for Always-On, On-Device AI Applications Now Available!

Flexible, low-power, always-on, on-device AI is increasingly a requirement in Edge devices that are battery operated or have thermal constraints. The new features of the Lattice sensAI stack are optimized to address this challenge, delivering improved accuracy, scalable performance, and ease-of-use, while still consuming only a few milliwatts of power. The updates to the sensAI stack include:

IP Cores – New CNN Compact Accelerator IP core for improved accuracy on iCE40 UltraPlus FPGA and enhanced CNN Accelerator IP core for improved performance on ECP5 FPGAs

Software Tools Updated – Neural network compiler tool with improved ease of use both Caffe and TensorFlow support for iCE40 UltraPlus FPGAs

Reference Designs – New human presence detection and hand gesture recognition reference designs and demos

Modular software platforms – New iCE40 UltraPlus development platforms including HiMax HM01B0 UPduino Shield and DPControl iCEVision Board,

Design Service Partners – New vehicle classification demo from Softnautics and package detection demo from Wipro.


Lattice – New Radiant IP and Reference Design

Lattice Radiant Software was rolled out earlier this year with the goal of making development and debugging with iCE40 UltraPlus a breeze. Radiant by itself is not enough to get users moving quickly, so we provided IP for the basic building blocks of the iCE40 UltraPlus device including PLL, DSP, Memory, I2C and SPI.

One of the values of Radiant is the ability to distribute IP and reference designs. We promised over the next 2 quarters more reference designs would be ported from iCECUBE2 and delivered for users to take advantage of Radiant.

During Q2 we converted five reference designs:

§ Single Wire Aggregation – eliminates signal congestion

§ Sensor Data Buffer – Makes iCE40 UltraPlus into a sensor hub

§ 6:1 Microphone Aggregation – Enables connecting microphones over SPI bus

§ SPI to MIPI-DSI – Connects a MIPI display to a process without DSI interface

These Reference designs and others were all covered in this white paper written to highlight the applications possible with the iCE40 UltraPlus FPGA. Over the next quarter more reference designs will be provided to solve issues and enable new ideas.

For additional information, please click HERE.

Ohmite: New Product Introduction




FCSL Current Sense New Product Announcement

New 0.5% Tolerance and New Sizes Product Extension

Ohmite is expanding it’s popular FCSL series. The FCSL series will now include a 0.5% tolerance option. In addition to this new tolerance, Ohmite will also offer two new sizes in this popular series. The FCSL20 and FCSL32 are common 0508 and 0612 sizes respectively. The call out is reversed as the leads are on the long edge of the chips for better current handling and cooling. The FCSL20 carries a power rating of 1 watt with a max current rating of 45 amps. The FCSL32 carries a power rating of 1.5 watts with a max current rating of 64 amps. The growth of the current sense market remains strong. With more applications using current sense resistors, the market demands more specific options leading to product extensions and new product series to accommodate. Ohmite will be expanding its current sense offering as the year continues. Ohmite distribution partners can expect to receive the NPI package shortly on the tolerance and size extensions.

For a datasheet, please click HERE.

Littelfuse: New! Fuse and Accessories Selection Guide


Littelfuse offers a comprehensive range of innovative fuses designed to address an expanding array of circuit protection challenges. However, identifying the optimum fuse for a specific application can be a confusing, time-consuming process.

The NEW! Fuse and Accessories Selection Guide is designed to speed and simplify this process, making it easier to optimize the reliability and performance of the application.

Order your print version by visiting the Littelfuse Business Center today!

LF New Fuse Selector Guide

ITT Cannon: The Next Generation of Soldier Worn Connectors

ITT CannonBetter connected. Better protected.

Today’s military must be equipped with the most advanced, effective combat systems available. From military grade tablets and smart phones to 3-D imaging headsets and hand-held radios, our rugged, high performance interconnect solutions transmit power, data & signal to a wide range of soldier-worn devices and equipment. No matter the environment, our highly engineered connectors withstand extreme temperature fluctuations, shock, vibration and high pressure to support soldiers in the field.

For more info please click image below or visit HERE

ITT Soldier Worn Connectors









EDS Summit 2018: Las Vegas

EDS logoThe Spectrum Sales team will be attending the 2018 EDS Summit at The Mirage in Las Vegas next week (May 15-18, 2018)! We’d like to wish all of our participating distribution partners and principals the very best of luck and safest of travels. We look forward to meeting with you both in and outside of meetings next week and hope to get time with each and every one of you!

For more information and a complete list of companies participating in the EDS Summit this year, please check out the links below:


Spectrum Sales

EDS Header

ERA Announces 2019 Conference Committee

ERA Press Release




FOR IMMEDIATE RELEASE: May 7, 2018 Contact: Neda Simeonova / Communications Director /

The Electronics Representatives Association (ERA) has announced the appointment of the chair, vice chair and members of the committee tasked with the development of its 50th Anniversary Management and Marketing Conference program, scheduled Feb. 24-26, 2019, at the AT&T Conference Center in Austin, Texas.

The chair of the committee is John Hutson, CPMR, of MacInnis Group and the vice chair is Mike Swenson of Mel Foster Company. Both Hutson and Swenson are returning committee members.

Hutson said, “It is an honor and a privilege to be chosen as the 2019 ERA Conference Chairperson. Although the incredible success of recent conferences, and the fact that the 2019 ERA Conference will be the 50th Anniversary Conference has set the bar exceptionally high, I am confident that delivering another gold medal performance will be possible with the outstanding conference planning committee that we have in place.”

The 2019 ERA Conference Committee is strategically made up of representatives, manufacturers and distributors with the goal of creating a diverse pool of experience and insight that result in the highest level of quality content to be shared at the ERA Conference.

In addition to Hutson and Swenson, other returning members of the ERA 2019 Conference Committee are: Ken Bellero of Schaffner EMC; Holly Myers, CPMR, of Wallace Electronic Sales; and Bryan White of Catalyst Sales Inc.

New members of the committee are: Kingsland Coombs, CPMR, CSP, of Control Sales; Paul Dosser of DigiKey; Brian Flynn of Sager Electronics; Terri Straube of Straube Associates Inc.; and Tom Vanderheyden of TTI Inc.

Coombs and Dosser will serve as co-chairs of the Keynote Committee; Straube and Vanderheyden will serve as co-chairs of the General Session Committee; Flynn and Myers will serve as co-chairs of the Breakout Sessions Committee; and Bellero and White will serve as co-chairs of the Sponsorship Committee.

ERA staff members on the committee are: Walter Tobin, the association’s CEO; Erin Collins, the conference coordinator; and Neda Simeonova, the conference app coordinator.

“This year’s ERA Conference Committee is made up of industry leaders who exceed all the criteria necessary for the making of a successful conference, and I am excited to watch them collectively work their magic,” Hutson said. “The right conference planning committee is vital to a successful conference, but so too is the commitment of the attendees. I hope that the industry shows its support for our Golden 50th Jubilee, and our industry as a whole, by supporting the conference through record-breaking attendance and sponsorship.”

ERA CEO Walter E. Tobin added, “ERA is thrilled to be hosting its 50th Golden Jubilee Conference at the AT&T Executive Education and Conference Center in Austin, Texas. This will be the fourth year in a row that we have held our conference at this great venue in such a great city. Following on the success of our last conference, which drew a record number of attendees, the 2019 Conference Committee is tasked with the mission of developing another outstanding program. I am confident that the 2019 50th Anniversary Conference will be a success!”